Custom Formable Polyimide Film for 3D Insulation Components

3D thermoformed Formable polyimide film for insulation

3D thermoformed heat resistant polyimed film

JP polyimide film for electrical insulation 3D thermoformable

High temperature electrical insulation film JP polyimide 3D film

3D die cutting JP polyimide film thermoformable for specialty

Categories Adhesive Tapes, High Temperature Tape, Insulation Tape Tags 3D polyimide film insulation, Formable polyimide film, insulation film, JP polyimide film, polyimed film, thermoformed film

Formable Polyimide Film is a high-performance polymer material mainly composed of polyimide. With outstanding heat and chemical resistance, these customized polyimide films can be thermoformed into various 3D profiles per your engineering drawings. Tight dimensional tolerances (±0.10mm) are maintained to ensure reliability. The molded polyimide parts offer high dielectric strength and thermal endurance, protecting windings from short circuits and thermal damage. Available in different thicknesses from 0.025mm to 0.50mm, these lightweight 3D films can be shaped into insulation gaskets for lithium battery casings or other 3D-shaped gaskets for automotive sensors and switches. It is also used as a thermoformed insulating gasket for various electronic components like speaker cones, domes, and surrounds, where insulation is required.

Features

Good plasticity, can be thermoformed at high temperature
High mechanical strength
Good abrasion resistance after molding
Excellent insulation properties
Good resistance to high temperature
Good chemical corrosion resistant
Good sealing and flame retardant properties.
High molding precision and flexible design
Thermoformed into any 3D designs easily

Structure

Product Name	DCA-FPI25	DCA-FPI38	DCA-FPI50	DCA-FPI125
Thickness(um)	25um	38um	50um	125um
Color options	AMBER
Width	520mm
Tensile strength (MP)	MD≥280 TD≥110	MD≥265 TD≥100	MD≥270 TD≥105	MD≥220 TD≥100
Elongation at break(%)	MD≥25 TD≥110	MD≥30 TD≥110	MD≥30 TD≥105	MD≥30 TD≥105
Breakdown Voltage(KV)	≥6KV
Surface Resistance	≥1×10^13Q
Tensile Modulus	3.5GPA
Long-termtemperature (°C )	260°C
Forming Pressure	1MPA(10KGS)
Forming Temperature	320-340°C

Applications

Thermoformed polyimide tape using polyimide film substrate of high temperature plasticity, can be molded in the hot press environment for a variety of special 3D shapes of the insulation components, both retained the excellent insulation properties of polyimide itself and mechanical strength, but also to achieve the insulating parts of the freedom of design and flexibility of the processing; this plasticity of the polyimide tape can be widely used in electric motor windings, electrical appliances, as well as aerospace equipment on the insulation structure of special requirements and space constraints, greatly simplifying the manufacturing process of insulation components, reducing production costs while improving product reliability and service life.

Application industry: