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UV Curing Dicing Tape | Premium PVC Base Film | Wafer Dicing
UV Curing Dicing Tape – Premium PVC Base Film
UV Curing Dicing Tape uses high-performance PVC as the base film, making it a high-end choice for semiconductor wafer dicing, grinding, thinning and die pickup. Compared with standard PET or PO tapes, our PVC-based UV curing tape offers better rigidity, higher dimensional stability and stronger process stability, perfectly matching high-precision production lines, cleanroom environments and fragile wafer processing.
It provides strong initial adhesion to hold wafers securely during dicing, and quickly reduces adhesion after UV exposure for clean, easy die release with no residue. This premium PVC dicing tape helps improve yield, reduce chipping and deformation, and supports stable long-term production.
Core Advantages – Premium PVC Base Film
Our UV curing dicing tape is upgraded with high-quality rigid PVC substrate, which greatly improves flatness, tensile strength and heat resistance. It effectively avoids warping, shifting and edge breakage in high-speed dicing and wet grinding, bringing more stable processing performance than ordinary materials.
Table of Contents
Features
- Premium PVC base film for high rigidity, anti-warping and anti-tearing performance
- Excellent dimensional stability, low shrinkage, high precision for micron-level dicing
- Strong holding force during processing; fast UV curing for clean, residue-free release
- Anti-static design, low VOC, compatible with Class 100 cleanroom
- Resistant to cutting fluid, cleaning chemicals and moisture
- Supports die cutting to custom sizes for automatic mounting machines
- Widely used for silicon wafers, glass, ceramics, QFN, LED and delicate components
Product Structure
- Surface layer: High-strength PVC base film (core high-end material)
- Middle layer: UV-sensitive acrylic adhesive with controllable adhesion
- Backing layer: Smooth release liner for easy lamination and application
Applications
- Ultra-thin wafer dicing and back grinding
- High-end IC, semiconductor and MEMS manufacturing
- LED and optoelectronic component dicing
- Glass and ceramic precision cutting
- High-density packaging and automatic pick-and-place systems
- Cleanroom-level microelectronic processing
Custom & Support
We provide custom slitting and die cutting for UV curing dicing tape, including jumbo rolls, narrow rolls and special sizes to fit your production equipment. Welcome to contact us for samples, specifications and bulk quotations.