Polyimide PI Film Die‑Cutting Parts, High Precision Kapton Tape Custom Die Cut Components
Experience reliable high‑temperature performance with our Custom Polyimide Kapton Die‑cut Parts‑ the ideal solution for electronics manufacturing, SMT reflow soldering and FPC gold finger protection.
Engineered with high‑grade polyimide Kapton film as carrier, these precision die‑cut components deliver outstanding heat resistance up to 260℃. Coated with premium silicone adhesive offers stable adhesion, solvent resistance and good electrical insulation, making it perfect to shield sensitive PCB and flexible circuit surfaces during high‑temperature assembly processes.
We provide full custom die‑cut service, including special shapes, holes, gaskets and any complex profile sizes. It leaves zero adhesive residue upon peeling off, well‑suited for precision electronics assembly and high‑volume SMT production jobs.
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Features
Experience exceptional precision with our custom Polyimide(Kapton) film die‑cutting parts — ideal solution for electronics assembly, SMT reflow, FPC shielding, high‑temperature protection applications.
Engineered from premium polyimide PI film as base material. We deliver micro tiny components with tight tolerance ±0.1mm, meanwhile support large‑size parts with multi‑layer composite structure. Excellent high temperature resistance up to 260℃, good dielectric property, chemical & solvent resistance. Clean peeling without residual adhesive, widely used for FPC gold finger protection, PCB masking, battery insulation and electronics shielding.
Custom sizes available, from ultra‑small miniature pieces to large format multi‑layer laminating parts. Our precision die‑cutting service delivers sharp clean edges, no burrs. It is perfect for complex profile, intricate small‑size and multi‑layer composite masking & insulating manufacturing jobs.
Excellent high temperature resistance, withstand short‑term temperature up to 260℃ for SMT reflow soldering.
- Premium polyimide (Kapton) film carrier, good electrical insulation and dielectric properties.
- Silicone adhesive system provides strong bonding and clean peel performance.
- No residual glue after removal, protects FPC gold fingers and circuit board surfaces.
- Custom die‑cut shapes available: gaskets, discs, frames, custom holes and complex profiles.
- Available in multiple thickness options for different electronics manufacturing applications.
- Good solvent, abrasion and chemical resistance for PCB & electronics processing.
- Slitting & custom size converting service for versatile industrial assembly usage.
