UV-Releasing Dicing Tape for Silicon Wafer Dicing and Die Sorting
Our UV dicing tapes feature a polyethylene or polyvinyl chloride base film and UV releasable adhesive to secure silicon wafers during dicing and die sorting processes. They provide excellent cutting performance and particle-free dicing with stable wafer fixing. The UV releasing adhesive ensures fast, residue-free release of dies after exposure to UV light for pick and place. These dicing tapes maintain constant characteristics across a wide temperature range. With high positional accuracy during die pick-up, our UV dicing tapes significantly improve die processing throughput and yield. They are available in various sizes and thicknesses for all wafer sawing needs. For high-speed dicing and reliable die ejection, rely on our UV releasable dicing tapes.
Get Free Samples & Custom Solutions We offer custom-sized UV dicing tape for different wafer sizes and processing requirements. Contact us today to discuss your application, request free samples, or get a competitive quote for bulk orders.
Table of Contents
Features
| Product Name | DCA-UV90 | DCA-UV130 | DCA-UV170 | DCA-UVP60 | DCA-UVP130 |
| TotalThickness (mm) |
0.09 | 0.13 | 0.17 | 0.06 | 0.13 |
| Base Film Thickness(mm) | 0.08 | 0.1 | 0.15 | 0.05 | 0.1 |
| Base Film | PO | PO | PO | PET | PET |
| Liner | PET film | PET-36 | PET-36 | PET-25 | PET-36 |
| Adhesive | Acrylic Adhesive | Acrylic Adhesive | Acrylic Adhesive | Acrylic Adhesive | Acrylic Adhesive |
| Peel force (Before UV) |
300gf/25mm | 1000gf/25mm | 1200gf/25mm | 800gf/25mm | 2000gf/25mm |
| Peel force (After UV) |
10gf/25mm | 20gf/25mm | 20gf/25mm | 10gf/25mm | 25gf/25mm |
| Tensile Strength （N/10mm） |
MD:21N/10mm TD:18N/10mm | MD:26kg/mm2 TD:22kg/mm2 | MD:38N/10mm TD:31N/10mm | MD:19kg/mm2 TD:21kg/mm2 | MD:21kg/mm2 TD:23kg/mm2 |
| Elongation （%） |
MD:600% TD:600% | MD:600% TD:600% | MD:600% TD:600% | MD:140% TD:120% | MD:150% TD:130% |
| Surface Resistance | / | / | / | 10^9-11 | 10^9-11 |
✅ Strong Temporary Adhesion High initial tack holds wafers securely during dicing, preventing shifting or chipping.
✅ Clean UV Release Low adhesion strength after UV exposure allows easy, residue-free pick-up of diced dies.
✅ Excellent Stability Resistant to cutting force, vibration, and temperature changes during processing.
✅ High Precision Uniform thickness and flatness ensure consistent dicing results for small, delicate dies.
✅ Wide Application Range Compatible with various wafer materials, including silicon, GaAs, sapphire, and ceramic substrates.
Common Applications Our UV dicing tape is widely used in precision manufacturing processes, including:
– Semiconductor wafer dicing and die singulation
– LED chip dicing and packaging – Electronic component processing (ICs, diodes, transistors)
– Sapphire and glass substrate dicing
– MEMS (Micro-Electro-Mechanical Systems) processing
Application & UV Release Instructions For best results, please follow these steps:
1. Apply the tape evenly to the wafer surface, ensuring no bubbles or wrinkles.
2. Mount the wafer onto the dicing frame securely.
3. Proceed with the dicing process under standard conditions.
4. After dicing, expose the tape to UV light (365 nm) for the recommended time.
5. The tape’s adhesion will drop significantly, allowing easy die pick-up with no residue.
