UV-Releasing Dicing Tape for Silicon Wafer Dicing and Die Sorting
Our UV dicing tapes feature a polyethylene or polyvinyl chloride base film and UV releasable adhesive to secure silicon wafers during dicing and die sorting processes. They provide excellent cutting performance and particle-free dicing with stable wafer fixing. The UV releasing adhesive ensures fast, residue-free release of dies after exposure to UV light for pick and place. These dicing tapes maintain constant characteristics across a wide temperature range. With high positional accuracy during die pick-up, our UV dicing tapes significantly improve die processing throughput and yield. They are available in various sizes and thicknesses for all wafer sawing needs. For high-speed dicing and reliable die ejection, rely on our UV releasable dicing tapes.
Table of Contents
Features
- UV releasable adhesive for fast, residue-free release.
- Securely holds wafers during dicing and die-sorting.
- Provides excellent cutting accuracy and particle-free dicing.
- Allows high-speed separation of dies after UV irradiation.
- Maintains constant characteristics across wide temperature range.
- Enables high positional accuracy during die pick-up.
- Available in various sizes and thicknesses.
Structure
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Applications
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