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April 23, 2024
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UV-Releasing Dicing Tape for Silicon Wafer Dicing and Die Sorting
Our UV dicing tapes feature a polyethylene or polyvinyl chloride base film and UV releasable adhesive to secure silicon wafers during dicing and die sorting processes. They provide excellent cutting performance and particle-free dicing with stable wafer fixing. The UV releasing adhesive ensures fast, residue-free release of dies after exposure to UV light for pick and place. These dicing tapes maintain constant characteristics across a wide temperature range. With high positional accuracy during die pick-up, our UV dicing tapes significantly improve die processing throughput and yield. They are available in various sizes and thicknesses for all wafer sawing needs. For high-speed dicing and reliable die ejection, rely on our UV releasable dicing tapes.
Table of Contents
Features
- UV releasable adhesive for fast, residue-free release.
- Securely holds wafers during dicing and die-sorting.
- Provides excellent cutting accuracy and particle-free dicing.
- Allows high-speed separation of dies after UV irradiation.
- Maintains constant characteristics across wide temperature range.
- Enables high positional accuracy during die pick-up.
- Available in various sizes and thicknesses.
Structure
| Product Name | DCA-UV90 | DCA-UV130 | DCA-UV170 | DCA-UVP60 | DCA-UVP130 |
| TotalThickness (mm) |
0.09 | 0.13 | 0.17 | 0.06 | 0.13 |
| Base Film Thickness(mm) | 0.08 | 0.1 | 0.15 | 0.05 | 0.1 |
| Base Film | PO | PO | PO | PET | PET |
| Liner | PET film | PET-36 | PET-36 | PET-25 | PET-36 |
| Adhesive | Acrylic Adhesive | Acrylic Adhesive | Acrylic Adhesive | Acrylic Adhesive | Acrylic Adhesive |
| Peel force (Before UV) |
300gf/25mm | 1000gf/25mm | 1200gf/25mm | 800gf/25mm | 2000gf/25mm |
| Peel force (After UV) |
10gf/25mm | 20gf/25mm | 20gf/25mm | 10gf/25mm | 25gf/25mm |
| Tensile Strength （N/10mm） |
MD:21N/10mm TD:18N/10mm | MD:26kg/mm2 TD:22kg/mm2 | MD:38N/10mm TD:31N/10mm | MD:19kg/mm2 TD:21kg/mm2 | MD:21kg/mm2 TD:23kg/mm2 |
| Elongation （%） |
MD:600% TD:600% | MD:600% TD:600% | MD:600% TD:600% | MD:140% TD:120% | MD:150% TD:130% |
| Surface Resistance | / | / | / | 10^9-11 | 10^9-11 |
Applications
Our UV dicing tapes feature a polyethylene or polyvinyl chloride base film and UV releasable adhesive to secure silicon wafers during dicing and die sorting processes. They provide excellent cutting performance and particle-free dicing with stable wafer fixing. The UV releasing adhesive ensures fast, residue-free release of dies after exposure to UV light for pick and place. These dicing tapes maintain constant characteristics across a wide temperature range. With high positional accuracy during die pick-up, our UV dicing tapes significantly improve die processing throughput and yield. They are available in various sizes and thicknesses for all wafer sawing needs. For high-speed dicing and reliable die ejection, rely on our UV releasable dicing tapes.
Applicable Industries:
- Dicing silicon wafers into dies or chips.
- Temporarily securing wafers on dicing frames during sawing.
- Sorting, picking and placing diced semiconductor dies.
- Ejecting dies quickly after UV exposure for further assembly.
- Protecting delicate micro-structures on wafer surface.
- Improving throughput and yield in die sorting processes.
